RoHS指令豁免项目总结
欧盟委员会针对豁免材料陆续发布了8 次决议，分别是：2002/95/EC、2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC和2008/385/EC，这些决议中的豁免共计32 项：1.小型荧光灯中的汞，汞含量不超过5mg/灯。【Mercury in compact fluorescent lamps notexceeding 5 mg per lamp.】2.普通用途直荧光灯中的汞，汞含量不超过：Mercuryinstraight fluorescent lamps for general purposesnotexceeding:·盐磷酸盐10mg.Halophosphate10mg;·普通寿命的三磷酸盐5mgTriphosphatewithnormal lifetime 5 mg;·长寿命的三磷酸盐8mgTriphosphatewithlong lifetime 8 mg.3.特殊用途直荧光灯中的汞Mercuryinstraight fluorescent lamps for specialpurposes.4本附录未明确提出的其他灯具中的汞Mercury inotherlamps not specifically mentioned in thisAnnex.5阴极射线管，电子元件以及荧光管的玻璃中的铅Lead in glassofcathode ray tubes, electronic components andfluorescenttubes.6铅作为合金元素在：Lead asanalloying element in:·钢合金，铅的重量含量不超过0.35 %Steelcontainingup to 0.35 % lead by weight;·铝合金，铅的重量含量不超过0.4%Aluminiumcontaining up to 0.4 % lead byweight;·铜合金，铅的重量含量不超过4%Copperalloycontaining up to 4 % lead by weight.7·用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%）Lead inhighmelting temperature type solders (i.e. lead-based alloyscontaining85 % by weight or more lead).·用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。Lead insoldersfor servers, storage and storage array systems,networkinfrastructure equipment for switching, signalling,transmission aswell as network management fortelecommunication.·电子陶瓷产品中的铅（如：高压电子装置）Lead inelectronicceramic parts (e.g. piezoelectronicdevices).8.根据修改关于限制特定危险物质和与制品销售和使用的第76/796/EEC号指令的91/338/EEC号指令禁止以外的镉电镀。Cadmium anditscompounds in electrical contacts and cadmium plating exceptforapplications banned under Directive 91/338/EEC amendingDirective76/769/EEC relating to restrictions on the marketing anduse ofcertain dangerous substances andpreparations.9.在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。Hexavalentchromium as an anti-corrosion of thecarbon steel cooling system inabsorptionrefrigerators.10.用于铅铜合金轴承和衬套中的铅。Leadinlead-bronze bearing shells and bushes.11.顺应针连接器系统中的铅。Lead usedincompliant pin connector systems.12.用于热传导模块C-环的被覆材料中的铅。Lead as acoatingmaterial for the thermal conductionmodulec-ring.13.用于光学及滤波器玻璃中的铅和镉。Lead andcadmiumin optical and filter glass.14.微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）。Lead insoldersconsisting of more than two elements fortheconnectionbetween thepinsand the package of microprocessors with a lead content of morethan80% and less than 85% by weight.15.集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。Lead in solderstocomplete a viable electrical connection between semiconductordieand carrier within integrated circuit FlipChippackages.16.用于带有硅酸盐灯管的线型白炽灯中的铅。Lead inlinearincandescent lamps with silicate coatedtubes.17.用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。Lead halideasradiant agent in High Intensity Discharge (HID) lamps usedforprofessional reprography applications.18.放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于含有磷元素（如BSP (BaSi2O5
b)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、固化工艺等等专业领域的灯具时。Lead asactivatorin the fluorescent powder (1 % lead by weight or less) ofdischargelamps when used as sun tanning lamps containing phosphorssuch asBSP (BaSi2O5b) as well as whenused as speciality lamps for diazo-printing reprography,lithography, insect traps, photochemical and curing processescontaining phosphors such as SMS ((Sr,Ba)2MgSi2O7b).
19.小型节能灯中作为主要汞合金的特定的PbBiSn-Hg和PbInSn-Hg中的铅，以及作为辅助汞合金的PbSn-Hg中的铅。
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions asmainamalgam and with PbSn-Hg as auxiliary amalgam in verycompactEnergy Saving Lamps (ESL).
20. LCD的平板荧光灯前后基板键合时所用玻璃中的铅。
Lead oxide in glass used for bonding front and rear substratesofflat
fluorescent lamps used for Liquid Crystal Displays (LCD).
21. 用在硅硼玻璃表面瓷釉上的印刷油墨中的铅和镉；
Lead and cadmium in printing inks for the application ofenamelson
borosilicate glass.
22. 在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅；
Lead as impurity in RIG (rare earth iron garnet) Faradayrotatorsused for fibre optic communications systems.
23.小螺距零部件表面处理中的铅（螺距不超过0.65mm且带镍铁边框的连接器，以及螺距不超过0.65mm且带铜边框的连接器不在豁免之内）
Lead in finishes of fine pitch components other than connectorswitha pitch of 0.65 mm or less with NiFe lead frames and leadinfinishes of fine pitch components other than connectors withapitch of 0.65 mm or less with copper lead frames.
24. 通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；
Lead in solders for the soldering to machined through holediscoidaland planararray ceramic multilayer capacitors.
25.等离子显示屏（PDP）及表面传导式电子发射显示器（SED）构件中所用的氧化铅，特别是在玻璃前后绝缘层中所用的氧化铅、总线电极中的氧化铅、黑条（彩色显像管）中的氧化铅、地址电极中的氧化铅、阻挡层肋柱的氧化铅、密封玻璃料中的氧化铅，以及封装玻璃中的氧化铅、环状玻璃中的氧化铅、印墨中的氧化铅；
Lead oxide in plasma display panels (PDP) and surfaceconductionelectron
emitter displays (SED) used in structural elements; notably inthefront and rear glass dielectric layer, the bus electrode, theblackstripe, the address electrode, the barrier ribs, the seal fritandfrit ring as well as in print pastes.
26. 黑蓝灯（BLB）玻璃封装中的氧化铅；
Lead oxide in the glass envelope of Black Light Blue(BLB)lamps.
27. 用作大功率扬声器（用在长时间操作125分贝以上的音响系统）的传感器中焊料的铅合金。
Lead alloys as solder for transducers used inhigh-powered(designated to operate for several hours at acousticpower levelsof 125 dB SPL and above)
loudspeakers.
29. 水晶玻璃中铅含量的限定依照欧盟指令69/493/EEC附件Ⅰ(第1、2、3、4类)。
Lead bound in crystal glass as defined in Annex I (Categories1, 2,3and 4) of Council Directive 69/493/EEC (*).
30. 用于位于音压级(SPL)大于或等于100 分贝的大功率扬声器音圈上的电导体的电气/机械焊点的镉合金。
Cadmium alloys as electrical/mechanical solder joints toelectricalconductors located directly on the voice coil intransducers usedin high-powered loudspeakers with sound pressurelevels of 100 dB(A) and more.
31. 用于无汞平板荧光灯（例如：用于液晶显示器、设计或工业照明）的焊料中的铅。
Lead in soldering materials in mercury free flat fluorescentlamps(which e.g. are used for liquid crystal displays, designorindustrial lighting).
32. 用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物。
Lead oxide in seal frit used for making window assemblies forArgonand
Krypton laser tubes.’
注：
1：依照欧盟决议2006/692/EC，第28条豁免项目将在2007年7月1日期中止。原第28条项目为：用于防腐或屏蔽电磁干扰，用在特定仪器设备中（欧盟指令2002/96/EC第三类规定的IT和通讯设备）的金属片或金属扣件上的防腐涂层中的六价铬。
2：2008年4月1日，欧洲法院（European CourtofJustice）发布公告：废除委员会决议2005/717/EC附件第9a条对聚合物中十溴二苯醚的豁免，裁定将于2008年7月1日执行。
3：以上豁免项目，若中文译文与英文原文意思上不一致, 以英文原文为准。